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5 in 1 IC Chip Repair Thin Blades CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools

USD 3.82USD 5.10

5 in 1 IC Chip Repair Thin Blades CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools

Description

IC CPU NAND Removal Graver Blade Glue Cleaning Remover Pry Knife Phone Repair Tool For iPhone Motherboard BGA Maintenance Rework

 

Description:

 

Proffesional repair tool set for iPhone CPU disassemble.

For BGA repair,dismantling phone CPU chip and phone repair.

It can be used to separate the welding spot.

 

Specification

Origin : Mainland China

Operating Temperature : 5

Model Number : ic

Package : SMD

Supply Voltage : 5

Application : Mobile Phone

Dissipation Power : 5

Condition : New

Type : Voltage Regulator

1PCS TEA6320 TEA6320T DIP
USD 1.70USD 1.95
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