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A8 A9 A10 CPU BGA Stencil For iPhone 6 6S 7 7P Bottom Layer IC Processor Reballing Pin Solder Tin Plant Net Steel Mesh MBGA-U3

CNY 20.73

A8 A9 A10 CPU BGA Stencil For iPhone 6 6S 7 7P Bottom Layer IC Processor Reballing Pin Solder Tin Plant Net Steel Mesh MBGA-U3

Description
Specification
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