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Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S21 ULtra SM-G998U/W/0/D CPU IC Chip Tin Planting Soldering Net

USD 4.50USD 9.00

Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S21 ULtra SM-G998U/W/0/D CPU IC Chip Tin Planting Soldering Net

Description
Specification
1PCS SSM2141P SSM2141 DIP8
USD 0.68USD 0.70
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