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BGA25 burn in socket pitch 0.5mm IC size 2.951x2.757mm BGA25(2.951x2.757)-0.5 BGA25 VFBGA25 burn in open top programmer socket
BGA25 OPEN TOP burn in socket pitch 0.5mm IC size 2.951x2.757mm BGA25(2.951x2.757)-0.5 BGA25 VFBGA25 burn in programmer socket
Specifications:
Part number:BGA25(2.951x2.757)-0.5-TP01NT
IC Package:BGA25 , VFBGA25
Pin Pitch:0.5mm
Pin Count:25pins
IC Size: 2.951x2.757 mm
Structure:OPEN-TOP
Material & Performance:
socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50m max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000M 700V DC
Max Current Capacity : 1A
Temperature Rating:-55~+175
Life Span 25,000 Times (Mechanical)
BGA socket New creation
connect with PCB ways Innovation
Tips:
If you want to buy more quantites about this one.please connect with me and ask me to get the better price.
Thanks.
Welding structure : No need of welding structure:
Way:Fix by welding Way:Fix by 4 screws
Pin length1.83mm Pin length0.25mm
Two structure features:
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it cant be recycle ;
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost ;
b.Connect with IC ways Innovation
1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.Ucontact support any type of solder ball shape
Ball\\no ball\\damaged ball,the drop of contact
surface is more than 0.2mm
C.HD picture to show the detailed product
Origin : Mainland China
is_customized : Yes
Condition : New
Type : Drive IC
