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MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net

USD 4.68USD 5.20

MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net

Description
Specification
CX8600-11Z QFN
USD 2.20
FTA04N60D FTA04N60 TO-220F
USD 0.19USD 0.21
MC33171P MC33171 DIP-8
USD 0.20USD 0.22
SN74HC27N 74HC27 DIP-14
USD 0.10USD 0.11
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